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When Non-Destructive Cleaning is Critical!
Removing Glue from Copper (15-B-091)
Removing Glue from Copper (15-B-091)
< Manufacturing and Industrial Facilities
Improve their cleaning performance.
Before
After
Cleaning Trial Type
Abrasive Cleaning
Industry
Manufacturing and Industrial Facilities
Substrate
Composite
Soil
Glue/Adhesive
Description of Part(s)
Copper/plastic lead-frames
Media Used
ARMEX™ Blast Media - Electronics P
Type of Blasting
Contained
Post Cleaning
De-ionized water rinse and air pressure dried
Recommendation to Customer
ARMEX® Electronics Formula P be used with #3 Nozzle at 10psi or 15psi blasting pressure in a Dry Blast Cabinet.