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When Non-Destructive Cleaning is Critical!

Removing Glue from Copper (15-B-091)

Removing Glue from Copper (15-B-091)

Improve their cleaning performance.
15-B-091 Before
Before
15-B-091 After
After
Cleaning Trial Type
Abrasive Cleaning
Industry
Manufacturing and Industrial Facilities
Substrate
Composite
Soil
Glue/Adhesive
Description of Part(s)
Copper/plastic lead-frames
Media Used
Type of Blasting
Contained
Post Cleaning
De-ionized water rinse and air pressure dried
Recommendation to Customer
ARMEX® Electronics Formula P be used with #3 Nozzle at 10psi or 15psi blasting pressure in a Dry Blast Cabinet.