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When Non-Destructive Cleaning is Critical!

Improve Wire Bondability to Sensitive Electronic Components (15-B-154)

Improve Wire Bondability to Sensitive Electronic Components (15-B-154)

< Manufacturing and Industrial Facilities
Improve cleaning performance and improve wire bondability of the laminate RF components.
15-B-154 Before
Before
15-B-154 After
After
Cleaning Trial Type
Abrasive Cleaning
Industry
Manufacturing and Industrial Facilities
Substrate
Composite
Description of Part(s)
Copper/brass and composite laminate RF component
Media Used

ARMEX™ Blast Media - Electronics P

Machine Used
Dry Blast Cabinet
Post Cleaning
De-ionized water rinse and air pressure dry
Recommendation to Customer
ARMEX® Blast Media– Electronics Formula P be used with a #3 Nozzle at 10 psi blasting pressure in a Dry Blast Cabinet.